LY IR9000 BGA Rework Station

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LY IR9000 BGA soldering Rework station, IR3000 was the original product developed on the basis of a dark red outside the BGA rework equipment. CBGA CCGA CSP QFN MLF PGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level μBGA welding, repairing. this new improved model offers software control and the ability to run pre defined profiles similar to the jovy.

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$499.99

LY IR9000

LY IR9000 BGA soldering Rework station, IR3000 was the original product developed on the basis of a dark red outside the BGA rework equipment. CBGA CCGA CSP QFN MLF PGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level μBGA welding, repairing. this new improved model offers software control and the ability to run pre defined profiles similar to the jovy.

This reworking station is designed mainly for laptops, desktops, switches, XBOX and other game consoles, motherboards and graphics cards and other communications BGA chip, shield and other repair and welding fields.


Features:
√ IR9000 through innovative design, effective solution to the ordinary infrared rework station heating process due to the slow warming of air flow caused the greatest defects. Desoldering process takes about 4 & Half minutes.
√ IR9000 with RS232 communications connector. Communication with the computer, the software supplied IRSOFT temperature control, computer control can be achieved. Can be set in paragraph 8 +8 temperature control temperature curve temperature curve can store 10 groups.
√ IR9000-contact temperature sensor can capture accurate, real-time temperature parameters BGA heat. Temperature control is more comfortable. ?? Welding is complete with alarm function. Now comes with a k type sensor
√ IR9000 no hot air rework process flow. Does not affect the surrounding small components. Heating plant can solder BGA chips, no hot air heating effect, no deformation of steel mesh, hand-ball BGA planting easier.
√ IR9000 large area can easily repair a variety of heating the upper part of CPU Block, various shielding enclosures, replacement of various components slot.
√ R & D, production and maintenance process owners take full account of the actual situation, auxiliary functions to streamline unnecessary, greatly reducing the cost of making high-quality, high success rate, cost-effective platform for BGA rework.
√ IR9000 design with integrated design, rework station more integrated, smaller area occupied table, no messy wires. One-button control, simple operation.
√ supplied product manuals, manuals and hand-planting the ball live video demo disc. Information easy to understand, plus ease of the platform, even if you never engaged in BGA rework can quickly master the technology.
√ warranty for three years, the first year free warranty, the second in three years to receive the parts cost.

This machine has many upgraded features over the old IR 6000 Inc Quartz Glass covering the bottom heater and elstein german made ceramic plates 

The parameters of LY IR-9000 BGA Rework Station

Basic Parameters

Heating

German infrared heater

Dimension

L480mm*W485mm*H420 mm

Weight

15.3kg

Total weight

About 17 kg, vary with the different need of the users

Electrical Parameters

7 amps

Power

220V AC

Upper Heating

German infrared heater

Size of Upper heating

60mm*60 mm

Consumption of upper heating

250W

Bottom Heating

German infrared heater

Size of Bottom heating

185 mm*185 mm

Consumption of Bottom heating

1000W

General power

1250W

Temperature Control

Control mode of Upper

Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm, USB linked computer systems, curve control

Control mode of Bottom

Independent temperature control, high-precision closed-loop control, precision± 0.5%, Alarm, USB

Rework Function

SMD

Suit for welding, remove or repair packaged devices such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield product and solder/lead free Rewor, kwelding

Size of applicable chips

≤70mm*70 mm

Size of applicable PCB

≤400mm*305 mm

1x CD manual

1x power cable

1x RS232 data cable

1x USB conversion cable for laptop

1x Allen key

1x AL tape free 

Helpful Tips
We offer a consultation service to help if you are in need of rework repair help or assistance to novice and experienced repair technicians  XModdz BGA Rework Reball Reflow PS3 Xbox 360 Laptop Consultation

Write a review

LY IR9000 BGA Rework Station

LY IR9000 BGA Rework Station

LY IR9000 BGA soldering Rework station, IR3000 was the original product developed on the basis of a dark red outside the BGA rework equipment. CBGA CCGA CSP QFN MLF PGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level μBGA welding, repairing. this new improved model offers software control and the ability to run pre defined profiles similar to the jovy.

Write a review

LY IR9000 BGA Rework Station <h1>LY&nbsp;IR9000</h1> <p>LY&nbsp;IR9000 BGA soldering Rework station, IR3000 was the original product developed on the basis of a dark red outside the BGA rework equipment. CBGA CCGA CSP QFN MLF PGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level &mu;BGA welding, repairing. this new improved model offers software control and the ability to run pre defined profiles similar to the jovy.</p> <p>This reworking station is designed mainly for laptops, desktops, switches, XBOX and other game consoles, motherboards and graphics cards and other communications BGA chip, shield and other repair and welding fields.</p> <p><br />Features:<br />&radic; IR9000 through innovative design, effective solution to the ordinary infrared rework station heating process due to the slow warming of air flow caused the greatest defects. Desoldering process takes about 4 & Half minutes.<br />&radic; IR9000 with RS232 communications connector. Communication with the computer, the software supplied IRSOFT temperature control, computer control can be achieved. Can be set in paragraph 8 +8 temperature control temperature curve temperature curve can store 10 groups.<br />&radic; IR9000-contact temperature sensor can capture accurate, real-time temperature parameters BGA heat. Temperature control is more comfortable. ?? Welding is complete with alarm function. Now comes with a k type sensor<br />&radic; IR9000 no hot air rework process flow. Does not affect the surrounding small components. Heating plant can solder BGA chips, no hot air heating effect, no deformation of steel mesh, hand-ball BGA planting easier.<br />&radic; IR9000 large area can easily repair a variety of heating the upper part of CPU Block, various shielding enclosures, replacement of various components slot.<br />&radic; R & D, production and maintenance process owners take full account of the actual situation, auxiliary functions to streamline unnecessary, greatly reducing the cost of making high-quality, high success rate, cost-effective platform for BGA rework.<br />&radic; IR9000 design with integrated design, rework station more integrated, smaller area occupied table, no messy wires. One-button control, simple operation.<br />&radic; supplied product manuals, manuals and hand-planting the ball live video demo disc. Information easy to understand, plus ease of the platform, even if you never engaged in BGA rework can quickly master the technology.<br />&radic; warranty for three years, the first year free warranty, the second in three years to receive the parts cost.</p> <p>This machine has many upgraded features over the old IR 6000 Inc Quartz Glass covering the bottom heater and elstein german made ceramic plates&nbsp;</p> <p>The parameters of LY IR-9000 BGA Rework Station</p> <p><strong>Basic Parameters</strong></p> <p>Heating</p> <p>German infrared heater</p> <p>Dimension</p> <p>L480mm*W485mm*H420 mm</p> <p>Weight</p> <p>15.3kg</p> <p>Total weight</p> <p>About 17 kg, vary with the different need of the users</p> <p><strong>Electrical Parameters</strong></p> <p>7 amps</p> <p>Power</p> <p>220V AC</p> <p>Upper Heating</p> <p>German infrared heater</p> <p>Size of Upper heating</p> <p>60mm*60 mm</p> <p>Consumption of upper heating</p> <p>250W</p> <p>Bottom Heating</p> <p>German infrared heater</p> <p>Size of Bottom heating</p> <p>185 mm*185 mm</p> <p>Consumption of Bottom heating</p> <p>1000W</p> <p>General power</p> <p>1250W</p> <p><strong>Temperature Control</strong></p> <p>Control mode of Upper</p> <p>Independent temperature control, high-precision closed-loop control, precision &plusmn; 0.5%, Alarm, USB linked computer systems, curve control</p> <p>Control mode of Bottom</p> <p>Independent temperature control, high-precision closed-loop control, precision&plusmn; 0.5%, Alarm, USB</p> <p><strong>Rework Function</strong></p> <p>SMD</p> <p>Suit for welding, remove or repair packaged devices such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield product and solder/lead free Rewor, kwelding</p> <p>Size of applicable chips</p> <p>&le;70mm*70 mm</p> <p>Size of applicable PCB</p> <p>&le;400mm*305 mm</p> <div>1x CD manual</div> <p>1x power cable</p> <p>1x RS232 data cable</p> <p>1x USB conversion cable for laptop</p> <p>1x Allen key</p> <p>1x AL tape free&nbsp;</p> <div><strong>Helpful Tips</strong></div> <div>We offer a consultation service to help&nbsp;if you are in need of rework repair help or assistance to novice and experienced repair technicians &nbsp;<a href="http://cgi.ebay.com/ws/eBayISAPI.dll?ViewItem&item=160793207651">XModdz BGA Rework Reball Reflow PS3 Xbox 360 Laptop Consultation</a></div>
$499.99